Northrop Grumman Microelectronics Center (NGMC) within Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and Semiconductor Process Integration Engineer or Principal Semiconductor Process Integration Engineer for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs.

Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn through a variety of challenging projects in R&D, ongoing long-term programs, and new programs targeting future military platforms. 

What You'll get to Do:

The Semiconductor Process Integration Engineer will be focused on Superconducting Electronics with a focus on Reciprocal Quantum Logic (RQL) devices. The candidate will need to support inspection and disposition of engineering material. The successful candidate will also support program execution for programs within the Micro Systems Technologies portfolio. Excellent verbal and written communication skills are required

Join us for the chance to work with an amazing, experienced, and talented team. We are expanding with new work on many development and production programs.

This requisition may be filled as a Semiconductor Process Integration Engineer or Principal Semiconductor Process Integration Engineer

Basic Qualifications for Semiconductor Process Integration Engineer

• Bachelor’s degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major plus 2 years of relevant experience; or a Master’s degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major plus 0 years of relevant experience.

• U.S. Citizenship required.

• The ability to obtain and maintain a DoD TS/SCI with poly clearance is required.  

• Must have an understanding of basic semiconductor processing, especially in Back End of Line (BEOL) process integration.

• Must have an aptitude for hands-on laboratory and experimental work.

• Must have an aptitude for defectivity reduction and continuous process improvements.

• Must be willing to work 2nd shift (Mon-Fri) 2:00pm-11:30pm (9/80 schedule available).

• Must be willing to work a sustainment position in a fabrication environment.

Basic Qualifications for Principal Semiconductor Process Integration Engineer

• Bachelor’s degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major plus 5 years of relevant experience; or a Master’s degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major plus 3 years of relevant experience; or a PhD in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major plus 0 years of relevant experience.

• U.S. Citizenship required.

• The ability to obtain and maintain a DoD TS/SCI with poly clearance is required.  

• Must have an understanding of basic semiconductor processing, especially in Back End of Line (BEOL) process integration.

• Must have an aptitude for hands-on laboratory and experimental work.

• Must have an aptitude for defectivity reduction and continuous process improvements.

• Must be willing to work 2nd shift (Mon-Fri) 2:00pm-11:30pm (9/80 schedule available).

• Must be willing to work a sustainment position in a fabrication environment.

Preferred Qualifications:

• Active TS/SCI clearance

• Course work in semiconductor processing, analog and microwave electronic circuits

• FEOL and BEOL semiconductor fabrication experience

• DC test analysis and production engineering experience

• Knowledge of yield improvement and defect reduction.

• Experience with DOEs, JMP, and statistical analysis

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