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Principal/Sr. Principal RF Microwave Design Engineer

In Person (Beavercreek, Ohio, United States of America | Cincinnati, Ohio, United States of America | Dayton, Ohio, United States of America)
Full Time
$100,300 – $150,500

Location:
Beavercreek, Ohio, United States of America | Cincinnati, Ohio, United States of America | Dayton, Ohio, United States of America

About Northrop Grumman

Northrop Grumman solves the toughest problems in space, aeronautics, defense and cyberspace to meet the ever-evolving needs of our customers worldwide. Our 90,000 employees are Defining Possible every day using science, technology and engineering to create and deliver advanced systems, products and services. Northrop Grumman careers and internships are as varied as your interests, with a lifetime of potential that will allow you to work together with people from many backgrounds, personal passions and disciplines.

NG Microelectronics Center is seeking an RF Engineer in Beavercreek, OH (Dayton, OH) to support system design and analysis. We are seeking engineers with the desire to learn new technologies to join our innovative organization to help develop, enhance and maintain cutting edge products and systems.

Boasting state-of-the-art design capabilities, multiple processing nodes, electrical testing, environmental and QCI screening, and failure analysis, the NGMC is a leader in designing, fabricating, packaging, and delivering discriminating microelectronics to the military, aerospace, and commercial markets.  For more than 70 years, we have been offering a wide range of trusted foundry and semiconductor services that deliver high performing and reliable microelectronics. Our wide breadth of technologies and capabilities allows us to provide our customers with unique “More than Moore” solutions.

The selected individual will work on designs across the full product life cycle. In this capacity, you will utilize your working knowledge of analysis, design, and I&T.

Are you seeking a challenging role with a strong team? Come define possible with us in Beavercreek, OH!

How you will contribute to the Mission:

  • Support design and verification efforts for RF, Analog, and High Speed Digital hardware
  • Collaborating with peer functions such as Mechanical, Manufacturing, Test, and Electrical design Engineers
  • Deriving and trading requirements with subsystem engineers and component level designers

This position can be filled at the Principal RF Engineer or Sr Principal RF Engineer level.

Basic Qualifications for Principal RF Engineer:

  • Bachelor of Science (BS) degree in science, technology, engineering, or related discipline with at least 5 years of experience; 3 years with Masters Degree; OR 1 year with a PhD
  • Experience with a 3d EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity)
  • Experience with simulation and optimization of PCB scale geometries including shields, vias, transmission lines, and connector interfaces
  • Experience extracting S-parameters of 3d geometries via multi port simulations
  • Experience working with software programing languages
  • Must be a US Citizen
  • Clearance: must have or be able to obtain and maintain a Full Top Secret security clearance with Polygraph

Basic Qualifications for Sr. Principal RF Engineer:

  • Bachelor of Science (BS) degree in science, technology, engineering, or related discipline with at least 8 years of experience; 6 years with Masters Degree; OR 4 years with a PhD
  • Experience with a 3d EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity)
  • Experience with simulation and optimization of PCB scale geometries including shields, vias, transmission lines, and connector interfaces
  • Experience extracting S-parameters of 3d geometries via multi port simulations
  • Experience working with software programing languages
  • Must be a US Citizen
  • Clearance: must have or be able to obtain and maintain a Full Top Secret security clearance with Polygraph

Preferred Qualifications:

  • Active Top Secret Security Clearance
  • Well versed in working with Ansys HFSS modeling of PCB structures
  • Experience modeling enclosure EMI interactions with PCBs
  • Experience with stackup definition and tradespaces
  • Experience with high speed digital signal integrity analysis >20 Gbps
  • Experience with Siemens Hyperlynx

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