The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Process Engineer for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs.

Northrop Grumman’s ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, and Silicon Carbide) and providing leading edge technology development in superconducting electronics. Our devices enable a number of Northrop Grumman’s ground based radars, avionic radars, and space systems.

Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in R&D, ongoing long term programs, and new programs targeting future military platforms.  Our multidisciplinary foundry team enables activities from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, test, and assembly.

The candidate must be a strong team participant, have excellent communication skills, and be resourceful and multitalented. A strong understanding of semiconductor technology, metrology processes, and equipment engineering is essential.

The Process Engineer will be responsible for but not limited to:

• All aspects of sustaining Plasma Etch, PVD, CVD, WETs, CMP, or Photolithography processes for semiconductor manufacturing. This includes process qualifications, technician training and certification, and process safety

• Interfacing with other unit process engineers and product integration engineers to develop processes to support emerging technologies

• Supporting statistical process control (SPC) and continuous improvement efforts 

• Establishing standard operating procedures and engaging the operations team to ensure these are followed

• Performs all other related duties as assigned

Must be able to work 2nd shift (Mon-Fri, 2:00PM-11:00PM), or 3rd shift (Mon-Fri, 10:00PM-7:00AM), or 4th shift (Fri-Sun, 7:00AM-7:00PM), or 5th shift (Fri-Sun, 7:00PM-7:00AM)

#NGATL

This requisition may be filled as a Process Engineer or Principal Process Engineer

Basic Qualifications Process Engineer:

• Bachelor’s Degree or higher in Materials Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or closely related discipline with 2 years technical related experience in semiconductor fabrication; Masters with 0 years exp

• Have basic understanding/knowledge of semiconductor Plasma Etch, PVD, CVD, WETs, CMP, Photolithography or other related semiconductor processing

• Able to work independently with hands-on experience in operating tools, gathering, and analyzing data

• Candidate must possess good interpersonal and communication skills, both written and verbal, problems solving skills with ability to work with a diverse group of people including engineers, technicians, and management

• US citizenship required

• Must be able to obtain and maintain a Secret Clearance

• Must be able to work 2nd shift (Mon-Fri, 2:00PM-11:00PM), or 3rd shift (Mon-Fri, 10:00PM-7:00AM), or 4th shift (Fri-Sun, 7:00AM-7:00PM), or 5th shift (Fri-Sun, 7:00PM-7:00AM)

Basic Qualifications Principal Process Engineer:

• Bachelor’s Degree or higher in Materials Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or closely related discipline with 5 years technical related experience in semiconductor fabrication;  Master’s Degree with 3 years’ experience; PhD with 0 years experience

• Have understanding/knowledge of semiconductor Plasma Etch, PVD, CVD, WETs, CMP, Photolithography or other related semiconductor processing

• Able to work independently with hands-on experience in operating tools, gathering, and analyzing data

• Candidate must possess good interpersonal and communication skills, both written and verbal, problems solving skills with ability to work with a diverse group of people including engineers, technicians, and management

• US citizenship required

• Must be able to obtain and maintain a Secret Clearance

• Must be able to work 2nd shift (Mon-Fri, 2:00PM-11:00PM), or 3rd shift (Mon-Fri, 10:00PM-7:00AM), or 4th shift (Fri-Sun, 7:00AM-7:00PM), or 5th shift (Fri-Sun, 7:00PM-7:00AM)

Preferred Qualifications:

• Hands-on experience in Plasma Etch, PVD, CVD, WETs, CMP, or Photolithography techniques and practices

• Experience in superconductor microelectronics will be highly desired

• Experience in lean manufacturing practices and structured problem-solving methodology

• User of various software packages commonly found in Semiconductor Wafer Fabs – EMS Systems (FactoryWorks or alike systems), statistical analysis tools – SPACE, JMP, Minitab, etc.

• Active Secret Clearance

#NGMCFab