NG Microelectronics Center is seeking an Electromechanical Engineer in Beavercreek, OH (Dayton, OH) to support system packaging design and thermal analysis. We are seeking engineers with the desire to learn new technologies to join our innovative organization to help develop, enhance and maintain cutting edge products and systems.

Boasting state-of-the-art design capabilities, multiple processing nodes, electrical testing, environmental and QCI screening, and failure analysis, the NGMC is a leader in designing, fabricating, packaging, and delivering discriminating microelectronics to the military, aerospace, and commercial markets.  For more than 70 years, we have been offering a wide range of trusted foundry and semiconductor services that deliver high performing and reliable microelectronics. Our wide breadth of technologies and capabilities allows us to provide our customers with unique “More than Moore” solutions.

The selected individual will work on designs across the full product life cycle process. In this capacity, you will utilize your working knowledge of analysis, development, qualification, and transition to production.

Are you seeking a challenging role with a strong team? Come define possible with us in Beavercreek, OH!

Duties include:

• Mechanical Design by designing 3D Model of chassis, covers, digital and RF printed wiring board assemblies, heat sinks, internal and external cabling.
• Create all mechanical drawings (component, printed wiring board assembly, sub-assembly and final assembly drawings and parts lists).
• Interface with vendors and fabricators to ensure deliverables meet mechanical requirements to include thermal, vibration, and structural.
• Rapid prototyping using 3D printers.
• Perform Finite Element Modeling(FEA) and, thermal and structural analysis (ANSYS) 

This position can be filled at the Principal Electromechanical Engineer or Senior Principal Electromechanical Engineer level.

Basic Qualifications for Principal Electromechanical Engineer:

• Bachelor of Science (BS) degree in science, technology, engineering, or related discipline with at least 5 years of experience; 3 years with Masters Degree; OR 0 years with a PhD
• Experience with a 3D CAD tool and MS Office
• Knowledge of Finite Element Analysis(FEA) and CFD to solve thermal and structural problems
• Must be a US Citizen
• Clearance: must have or be able to obtain and maintain a Full Top Secret security clearance with Polygraph

Basic Qualifications for Sr. Principal Electromechanical Engineer:

• Bachelor of Science (BS) degree in science, technology, engineering, or related discipline with at least 8 years of experience; 6 years with Masters Degree; OR 3 years with a PhD
• Experience with a 3D CAD tool and MS Office
• Knowledge of Finite Element Analysis(FEA) and CFD to solve thermal and structural problems
• Must be a US Citizen
• Clearance: must have or be able to obtain and maintain a Full Top Secret security clearance with Polygraph

Preferred Qualifications:

• Active Top Secret Security Clearance
• Experience with the following applications: SolidWorks, AutoCAD, Ansys Icepak
• Experience taking multiple designs from concept through fabrication
• Experience designing for, maintaining, and operating 3D printers
• Experience with liquid cooled designs

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