The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an independent and resourceful Plasma Enhanced Chemical Vapor Deposition (PECVD) Semiconductor Process Engineer.

Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland – is where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry has unique capabilities supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. Our devices enable a number of Northrop Grumman’s ground-based radars, avionic radars, and space systems. 

Join us for the chance to work with an experienced and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in production, R&D, ongoing long-term programs, and new programs targeting future military platforms.

Our multidisciplinary foundry team enables activities from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, testing, and assembly.

This is a full-time 1st shift position, covering at a minimum Monday – Friday.

The Plasma Enhanced Chemical Vapor Deposition (PECVD) Semiconductor Process Engineer will be responsible for:

All aspects of sustaining existing PECVD processes for a development line including process qualifications and technician training. Interfacing with other unit process engineers, operations, and integration engineers during the design and execution of process/equipment improvement projects. Developing PECVD processes for new materials. Developing new PECVD processes for emerging technologies in both microelectronics and superconducting electronics. Writing and maintaining process documentation. Supporting statistical process control (SPC) and continuous improvement efforts Performing all other related duties as assigned

#NGATL

This requisition may be filled as a Principal PECVD Semiconductor Process Engineer or Senior Principal PECVD Semiconductor Process Engineer

Basic Qualifications for Principal PECVD Semiconductor Process Engineer:

• Bachelors of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or other related technical discipline with 5 years of relevant experience (3 years with a MS, 0 with a PhD).

• Must have PECVD industry experience

• Hands-on experience running semiconductor process equipment and with process sustaining/development activities.

• Must be able to work independently, providing technical solutions to a wide range of complex problems.

• Must be able to work a large percentage of time working in a Class 100 cleanroom environment.

• Must be able to work the weekday shift, covering at a minimum Monday – Friday

• Knowledge of statistical process control (SPC).

• Must be a US Citizen

• Must be able to obtain and maintain a Secret clearance.

Basic Qualifications for Senior Principal PECVD Semiconductor Process Engineer:

 • Bachelors of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or other related technical discipline with 8 years of relevant experience (6 years with a MS and 3 with a PhD).

• Must have PECVD industry experience

• Hands-on experience running semiconductor process equipment and with process sustaining/development activities.

• Must be able to work independently, providing technical solutions to a wide range of complex problems.

• Must be able to work a large percentage of time working in a Class 100 cleanroom environment.

• Must be able to work the weekday shift, covering at a minimum Monday – Friday

• Knowledge of statistical process control (SPC).

• Must be a US Citizen

• Must be able to obtain and maintain a Secret clearance.

Preferred Qualifications:

• Direct experience with semiconductor fabrication, working in a cleanroom environment.

• Hands-on experience running PECVD/Diffusion/Implant/RTP process equipment and with process sustaining/development activities.

• Experience with TEOS- and silane-based dielectric deposition

• Experience with thin film characterization equipment and techniques

• Experience with PECVD, ALD, MOCVD, Diffusion, RTA/RTP, Implant

• Demonstrated ability to communicate well with others and work independently

• Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions.

• Experience in structured problem-solving methodology to troubleshoot tool and process issues.

• Data analysis and visualization (JMP and/or MiniTab).

• Advanced knowledge of statistical process control (SPC).

• Active Secret clearance.

#NGMCFoundry