Principal or Sr. Principal RF Modeling and Sim Engineer
- Location:
- McClellan, California, United States of America
About Northrop Grumman

Northrop Grumman solves the toughest problems in space, aeronautics, defense and cyberspace to meet the ever-evolving needs of our customers worldwide. Our 90,000 employees are Defining Possible every day using science, technology and engineering to create and deliver advanced systems, products and services. Northrop Grumman careers and internships are as varied as your interests, with a lifetime of potential that will allow you to work together with people from many backgrounds, personal passions and disciplines.
For more than 50 years, we have been offering a wide range of trusted foundry and semiconductor services that deliver high performing and reliable microelectronics. Our wide breadth of technologies and capabilities includes research in advanced computing solutions to provide our customers with unique “More than Moore” solutions. Microelectronics | Northrop Grumman
The Northrop Grumman Microelectronics Design & Applications (MDA) business area is leading efforts to transform computing, combining the unique properties of superconductivity and quantum mechanics to develop revolutionary energy-efficient computing systems. You will work in a fast-paced team environment alongside a broad array of scientists and engineers to make these next generation processing solutions a reality.
We are seeking experienced RF Modeling and Simulation Engineers to join our Sacramento, California design center. You will apply your skills as an RF engineer to advance superconducting processor solutions in support of Northrop Grumman's advanced microelectronics applications business.
This position requires work on site at Northrop Grumman’s McClellan, CA facility.
What You’ll get to Do:
- Design, model, and verify RF, microwave, and mixed signal subsystem assemblies
- Support verification and validation efforts for RF, analog, and digital hardware designs
- Collaborate with peer functions in Mechanical, Manufacturing, Test, and IC design engineering
- Derive and trade requirements with subsystem engineers and component level designers
- Work directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements
This position may be filled as a Principal RF Modeling and Simulation Engineer OR Sr. Principal RF Modeling and Simulation Engineer level based on the qualifications below.
Basic Qualifications for Principal RF Modeling and Simulation Engineer
- Bachelor of Science STEM (Science, Technology, Engineering, Mathematics) degree with 5 years of experience as RF Analog, Digital or Mixed Signal design engineer or 3 years of experience with a master's degree.
- Working knowledge of an EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity).
- Experience working with software programing languages (e.g. skill, python).
- Prior experience working with electronics, mechanical requirements, and schematic drawings.
- Ability to obtain and maintain a Top Secret/Sensitive Compartmented Information (TS/SCI) security clearance (US Citizenship is a requirement for this).
Basic Qualifications for Sr. Principal RF Modeling and Simulation Engineer
- Bachelor of Science STEM (Science, Technology, Engineering, Mathematics) degree with 8 years of experience as RF Analog, Digital or Mixed Signal design engineer, or 3 years of experience with a master's degree.
- Working knowledge of an EM simulation tool (HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity).
- Experience working with software programing languages (e.g. skill, python).
- Prior experience working with electronics, mechanical requirements, and schematic drawings.
- Ability to obtain and maintain a Top Secret/Sensitive Compartmented Information (TS/SCI) security clearance (US Citizenship is a requirement for this).
Preferred Qualifications
- Well versed in working with Ansys HFSS modeling for RF packaging effects.
- Experience with spectrum and network analyzer techniques for EMC measurements.
- Hands on experience utilizing test instrumentation such and power supplies, oscilloscopes, spectrum analyzers, for RF or high-speed digital IO circuits.
- Prior experience with packaging technologies (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.).
- Experience with cryogenic test stands, superconductivity and mechanical CTE.
- Active TS/SCI security clearance with polygraph.
Our Values. The women and men of Northrop Grumman Corporation are guided by Our Values. They describe our company as we want it to be. We want our decisions and actions to demonstrate these Values. We believe that putting Our Values into practice creates long-term benefits for shareholders, customers, employees, suppliers, and the communities we serve.
Our Responsibility. At Northrop Grumman, we are committed to maintaining the highest of ethical standards, embracing diversity and inclusion, protecting the environment, and striving to be an ideal corporate citizen in the community and in the world.
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