LTAMDS Task Lead
- Location:
- Tewksbury, Massachusetts, United States of America
About Raytheon

With facilities in Broughton, Waddington, Glenrothes, Harlow, Gloucester, Manchester with presence across other customer sites also. Raytheon UK is invested in the British workforce and the development of UK technology. Across the country Raytheon UK employs 1,700 people and supports 8,000 jobs. As a prime contractor and major supplier to the U.K. Ministry of Defence, Raytheon continues to invest in research and development, supporting innovation and technological advances. Raytheon UK is a landed company, part of the Raytheon Technologies organisation and sits within the Raytheon Intelligence & Space business.
Date Posted:
2025-02-18Country:
United States of AmericaLocation:
MA131: Tewksbury, MA Bldg 1 Assabet 50 Apple Hill Drive Assabet - Building 1, Tewksbury, MA, 01876 USAPosition Role Type:
OnsiteThe Task Lead (Sub-IPT) reports to the LTAMDS Array IPT Lead. The LTAMDS program is a multiple year, multiple customer program that will be ramping up in production. The Sub-IPT lead will own one or more RF products and be responsible for execution of hardware delivery to the Array. This will include oversite of material delivery, build, and test. The work will involve support in the IADC facility as well as suppliers (as needed). CONUS And OCONUS travel will be required under 10% of the time. This role involves understanding of EVMS and MS project planning. This role involves cross functional collaboration and basic understanding of module level RF test, Near Field Range & Far Field range testing.
Tasks include supporting development or production, leading proposal activities, and technical management of both engineering disciplines and suppliers for programs throughout the product life cycle.
Successful candidate will be a self-starter with proven project organization and execution skills, multi-tasking and verbal/written communication and presentation skills, and experience in a budget and schedule critical environment. Candidates should lead multi-discipline teams to develop systems from concept through integration and production, and develop solutions to a variety of technical problems of large scope and complexity. A candidate willing to collaborate and coordinate with Operations, Supply Chain, Quality, and other Engineering disciplines to resolve issues. Qualified candidates must have experience with digital, analog and/or RF testing and experience debugging complex circuit card assemblies or electro-mechanical systems. Knowledge of RF / microwave devices preferred.
What You Will Do
- Lead others by understanding team dynamics and capitalizing on team strengths while mitigating gaps
- Lead trade studies to determine the best solution and plan forward for solving complex problems while considering quality, cost, schedule, and performance
- Regularly convey task status on complex issues and strategic plans across multiple teams, program, department, and customer leadership
- Seek opportunities to fill any role necessary to help ensure business unit success
- Partner with the program team to ensure cost, schedule, and technical requirements are fully integrated and executed as planned
Qualifications You Must Have
- Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM)
- Minimum of 5 years of engineering experience with progressing leadership roles
- Experience with any of the following as it relates to electrical subsystems and/or circuit card assembly:
- Development
- Integration
- Test
- Production support
- Experience with analog, digital and/or mixed signal circuit design/analysis or hardware integration/test
- The ability to obtain and maintain a US security clearance prior to the start date. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance
Qualifications We Value
- Experience in the design, test and sell off of military systems
- Demonstrated ability to work with a complex engineering team
- Solid understanding of hardware testing methodologies
- Experience in Root-Cause Corrective Action investigations and FRACAS processes
- Knowledge and experience with Material Review Board, Process Configuration Board, Configuration Control Board and Failure Review Board processes, proposing/defending and implementing Change Notices
- Experience in resolving production issues with suppliers and sub-tier suppliers
- A minimum of 6 years of experience in the assembly, integration and test of EO and RF subsystems
- Mentor Graphics DxDesigner experience and command of circuit simulation and analysis tools such as PSPICE, System Vision
- Knowledge of printed circuit board fabrication and circuit card assembly processes and related industry specifications
- Familiarity with missile communication transceivers and data links, IR or RF sensors, inertial measurement units (IMU) and Global Positioning System (GPS) receiver subsystems
- Planning and leading hardware subsystem development activities
- Experience managing cost and schedule with Earned Value Management methodologies
- Technical writing and/or formal presentation experience
- Master’s degree in STEM or MBA
What We Offer
Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Trust, Respect, Accountability, Collaboration, and Innovation.
This position offers relocation based on candidate eligibility.
This position requires a security clearance. DCSA Consolidated Adjudication Services (DCSA CAS), an agency of the Department of Defense, handles and adjudicates the security clearance process. More information about Security Clearances can be found on the US Department of State government website here: https://www.state.gov/m/ds/clearances/c10978.htm
RTX is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability or veteran status, or any other applicable state or federal protected class. RTX provides affirmative action in employment for qualified Individuals with a Disability and Protected Veterans in compliance with Section 503 of the Rehabilitation Act and the Vietnam Era Veterans’ Readjustment Assistance Act.
Privacy Policy and Terms:
Click on this link to read the Policy and Terms
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2025-02-03Country:
United States of AmericaLocation:
MA131: Tewksbury, MA Bldg 1 Assabet 50 Apple Hill Drive Assabet - Building 1, Tewksbury, MA, 01876 USAPosition Role Type:
OnsiteThe Task Lead (Sub-IPT) reports to the LTAMDS Array IPT Lead. The LTAMDS program is a multiple year, multiple customer program that will be ramping up in production. The Sub-IPT lead will own one or more RF products and be responsible for execution of hardware delivery to the Array. This will include oversite of material delivery, build, and test. The work will involve support in the IADC facility as well as suppliers (as needed). CONUS And OCONUS travel will be required under 10% of the time. This role involves understanding of EVMS and MS project planning. This role involves cross functional collaboration and basic understanding of module level RF test, Near Field Range & Far Field range testing.
Tasks include supporting development or production, leading proposal activities, and technical management of both engineering disciplines and suppliers for programs throughout the product life cycle.
Successful candidate will be a self-starter with proven project organization and execution skills, multi-tasking and verbal/written communication and presentation skills, and experience in a budget and schedule critical environment. Candidates should lead multi-discipline teams to develop systems from concept through integration and production, and develop solutions to a variety of technical problems of large scope and complexity. A candidate willing to collaborate and coordinate with Operations, Supply Chain, Quality, and other Engineering disciplines to resolve issues. Qualified candidates must have experience with digital, analog and/or RF testing and experience debugging complex circuit card assemblies or electro-mechanical systems. Knowledge of RF / microwave devices preferred.
What You Will Do
- Lead others by understanding team dynamics and capitalizing on team strengths while mitigating gaps
- Lead trade studies to determine the best solution and plan forward for solving complex problems while considering quality, cost, schedule, and performance
- Regularly convey task status on complex issues and strategic plans across multiple teams, program, department, and customer leadership
- Seek opportunities to fill any role necessary to help ensure business unit success
- Partner with the program team to ensure cost, schedule, and technical requirements are fully integrated and executed as planned
Qualifications You Must Have
- Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM)
- Minimum of 5 years of engineering experience with progressing leadership roles
- Experience with any of the following as it relates to electrical subsystems and/or circuit card assembly:
- Development
- Integration
- Test
- Production support
- Experience with analog, digital and/or mixed signal circuit design/analysis or hardware integration/test
- The ability to obtain and maintain a US security clearance prior to the start date. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance
Qualifications We Value
- Experience in the design, test and sell off of military systems
- Demonstrated ability to work with a complex engineering team
- Solid understanding of hardware testing methodologies
- Experience in Root-Cause Corrective Action investigations and FRACAS processes
- Knowledge and experience with Material Review Board, Process Configuration Board, Configuration Control Board and Failure Review Board processes, proposing/defending and implementing Change Notices
- Experience in resolving production issues with suppliers and sub-tier suppliers
- A minimum of 6 years of experience in the assembly, integration and test of EO and RF subsystems
- Mentor Graphics DxDesigner experience and command of circuit simulation and analysis tools such as PSPICE, System Vision
- Knowledge of printed circuit board fabrication and circuit card assembly processes and related industry specifications
- Familiarity with missile communication transceivers and data links, IR or RF sensors, inertial measurement units (IMU) and Global Positioning System (GPS) receiver subsystems
- Planning and leading hardware subsystem development activities
- Experience managing cost and schedule with Earned Value Management methodologies
- Technical writing and/or formal presentation experience
- Master’s degree in STEM or MBA
What We Offer
Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Trust, Respect, Accountability, Collaboration, and Innovation.
This position offers relocation based on candidate eligibility.
This position requires a security clearance. DCSA Consolidated Adjudication Services (DCSA CAS), an agency of the Department of Defense, handles and adjudicates the security clearance process. More information about Security Clearances can be found on the US Department of State government website here: https://www.state.gov/m/ds/clearances/c10978.htm
RTX is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability or veteran status, or any other applicable state or federal protected class. RTX provides affirmative action in employment for qualified Individuals with a Disability and Protected Veterans in compliance with Section 503 of the Rehabilitation Act and the Vietnam Era Veterans’ Readjustment Assistance Act.
Privacy Policy and Terms:
Click on this link to read the Policy and Terms